Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057479 | Semiconductor device having a junction portion contacting a Schottky metal | — | 2024-08-06 |
| 12021120 | SiC semiconductor device | Masaya Ueno, Yuki Nakano, Sawa HARUYAMA, Seiya NAKAZAWA, Yasunori Kutsuma | 2024-06-25 |
| 11916112 | SiC semiconductor device | Yuki Nakano, Masaya Ueno, Seiya NAKAZAWA, Sawa HARUYAMA, Yasunori Kutsuma | 2024-02-27 |