Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142648 | Semiconductor device with sic semiconductor layer and raised portion group | Sawa HARUYAMA | 2024-11-12 |
| 12021120 | SiC semiconductor device | Masaya Ueno, Yuki Nakano, Sawa HARUYAMA, Yasuhiro Kawakami, Yasunori Kutsuma | 2024-06-25 |
| 11916112 | SiC semiconductor device | Yasuhiro Kawakami, Yuki Nakano, Masaya Ueno, Sawa HARUYAMA, Yasunori Kutsuma | 2024-02-27 |