Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142648 | Semiconductor device with sic semiconductor layer and raised portion group | Seiya NAKAZAWA | 2024-11-12 |
| 12057512 | Semiconductor device | Masaya Ueno, Masaya SAITO | 2024-08-06 |
| 12021120 | SiC semiconductor device | Masaya Ueno, Yuki Nakano, Yasuhiro Kawakami, Seiya NAKAZAWA, Yasunori Kutsuma | 2024-06-25 |
| 11916112 | SiC semiconductor device | Yasuhiro Kawakami, Yuki Nakano, Masaya Ueno, Seiya NAKAZAWA, Yasunori Kutsuma | 2024-02-27 |