Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929300 | Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Andrew Arthur Ketterson, Tarak A. Railkar, Deep C. Dumka, Christo Bojkov | 2024-03-12 |