Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929300 | Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Tarak A. Railkar, Deep C. Dumka, Christo Bojkov | 2024-03-12 |
| 11908808 | Monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding | — | 2024-02-20 |