Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948838 | Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same | — | 2024-04-02 |
| 11929300 | Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Andrew Arthur Ketterson, Tarak A. Railkar, Christo Bojkov | 2024-03-12 |