Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154866 | Method of fabricating a flip-chip package core substrate with build-up layers | Pao-Hung Chou, Chun-Hsien Yu, Tung-Yao Kuo | 2024-11-26 |
| 12094922 | Inductance traces protected through shielding layers | Pao-Hung Chou, Chun-Hsien Yu | 2024-09-17 |
| 12062685 | Inductor structure having conductive sheets having fan plate shape arranged in ring structure and fabrication method thereof, electronic package and fabrication method thereof, and method for fabricating packaging carrier | — | 2024-08-13 |