Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154866 | Method of fabricating a flip-chip package core substrate with build-up layers | Chun-Hsien Yu, Shih-Ping Hsu, Tung-Yao Kuo | 2024-11-26 |
| 12094922 | Inductance traces protected through shielding layers | Chun-Hsien Yu, Shih-Ping Hsu | 2024-09-17 |