Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154866 | Method of fabricating a flip-chip package core substrate with build-up layers | Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu | 2024-11-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154866 | Method of fabricating a flip-chip package core substrate with build-up layers | Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu | 2024-11-26 |