YD

Yunxiang Di

NI Ningbo Semiconductor International: 1 patents #6 of 11Top 55%
Overall (2024): #203,424 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11979136 Air gap type semiconductor device package structure Mengbin Liu, Situo Xu 2024-05-07