Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11979136 | Air gap type semiconductor device package structure | Yunxiang Di, Situo Xu | 2024-05-07 |
| 11917918 | Fingerprint identification module, method for forming fingerprint identification module, and electronic device | Hu SHI, Yanghui Xiang | 2024-02-27 |