Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11979136 | Air gap type semiconductor device package structure | Yunxiang Di, Mengbin Liu | 2024-05-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11979136 | Air gap type semiconductor device package structure | Yunxiang Di, Mengbin Liu | 2024-05-07 |