Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183792 | SiC composite substrate and composite substrate for semiconductor device | Kiyoshi MATSUSHIMA, Jun Yoshikawa, Morimichi Watanabe | 2024-12-31 |
| 12080551 | SiC composite substrate including biaxially oreinted SiC layer and semiconductor device | Kiyoshi MATSUSHIMA, Jun Yoshikawa, Morimichi Watanabe | 2024-09-03 |