Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183792 | SiC composite substrate and composite substrate for semiconductor device | Jun Yoshikawa, Morimichi Watanabe, Risa MIYAKAZE | 2024-12-31 |
| 12125883 | Biaxially oriented SiC composite substrate and semiconductor device composite substrate | Morimichi Watanabe, Jun Yoshikawa | 2024-10-22 |
| 12080551 | SiC composite substrate including biaxially oreinted SiC layer and semiconductor device | Risa MIYAKAZE, Jun Yoshikawa, Morimichi Watanabe | 2024-09-03 |
| 12065383 | Oriented ceramic sintered body production method and flat sheet | Morimichi Watanabe, Kei Sato, Takahiro Maeda, Jun Yoshikawa, Tsutomu Nanataki | 2024-08-20 |