Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183792 | SiC composite substrate and composite substrate for semiconductor device | Kiyoshi MATSUSHIMA, Jun Yoshikawa, Risa MIYAKAZE | 2024-12-31 |
| 12163249 | Ground substrate and method for producing same | Jun Yoshikawa | 2024-12-10 |
| 12159907 | Semiconductor film | Hiroshi Fukui, Jun Yoshikawa | 2024-12-03 |
| 12125883 | Biaxially oriented SiC composite substrate and semiconductor device composite substrate | Kiyoshi MATSUSHIMA, Jun Yoshikawa | 2024-10-22 |
| 12080551 | SiC composite substrate including biaxially oreinted SiC layer and semiconductor device | Risa MIYAKAZE, Kiyoshi MATSUSHIMA, Jun Yoshikawa | 2024-09-03 |
| 12065383 | Oriented ceramic sintered body production method and flat sheet | Kei Sato, Kiyoshi MATSUSHIMA, Takahiro Maeda, Jun Yoshikawa, Tsutomu Nanataki | 2024-08-20 |
| 11942520 | Semiconductor film | Hiroshi Fukui | 2024-03-26 |