Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113046 | Method for preparing semiconductor device with wire bond | Wei Li, Chien-Chung Wang, Hsih-Yang Chiu | 2024-10-08 |
| 11876072 | Method for preparing semiconductor device with wire bond | Wei Li, Chien-Chung Wang, Hsih-Yang Chiu | 2024-01-16 |