Issued Patents 2024
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183715 | Method for manufacturing semiconductor structure | Ting-Cih KANG | 2024-12-31 |
| 12185529 | Semiconductor device with programmable structure and method for fabricating the same | Wei Li | 2024-12-31 |
| 12178039 | Memory device having merged active area | Wei Li | 2024-12-24 |
| 12167591 | Semiconductor device with programmable structure and method for fabricating the same | Wei Li | 2024-12-10 |
| 12148731 | Method of manufacturing semiconductor device having air cavity in RDL structure | — | 2024-11-19 |
| 12133378 | Semiconductor structure | Wei Li | 2024-10-29 |
| 12125642 | Method of manufacturing capacitor structure | Chien-Chung Wang | 2024-10-22 |
| 12114491 | Semiconductor device with programmable unit and method for fabricating the same | — | 2024-10-08 |
| 12113046 | Method for preparing semiconductor device with wire bond | Wei Li, Yi-Ting Shih, Chien-Chung Wang | 2024-10-08 |
| 12100733 | Semiconductor device with leakage current guide path and method for fabricating the same | Wei Li | 2024-09-24 |
| 12068203 | Method for manufacturing semiconductor device structure | — | 2024-08-20 |
| 12062656 | Semiconductor device structure | — | 2024-08-13 |
| 12033956 | Interconnect structure | Ting-Cih KANG | 2024-07-09 |
| 12027575 | Method for fabricating semiconductor structure | Ting-Cih KANG | 2024-07-02 |
| 11984397 | Semiconductor structure | Wei Li | 2024-05-14 |
| 11984389 | Integrated circuit package structure with conductive stair structure and method of manufacturing thereof | Chien-Chung Wang | 2024-05-14 |
| 11967612 | Method of manufacturing semiconductor structure | Ting-Cih KANG | 2024-04-23 |
| 11955427 | Method of forming electrical fuse matrix | — | 2024-04-09 |
| 11950409 | Semiconductor device having diode connectedto memory device and circuit including the same | — | 2024-04-02 |
| 11935851 | Semiconductor structure having polygonal bonding pad | — | 2024-03-19 |
| 11894247 | Method of manufacturing semiconductor device having hybrid bonding interface | — | 2024-02-06 |
| 11876077 | Semiconductor device and method of manufacturing the same | Yi-Jen Lo, Ching-Hung Chang, Chiang-Lin Shih | 2024-01-16 |
| 11876072 | Method for preparing semiconductor device with wire bond | Wei Li, Yi-Ting Shih, Chien-Chung Wang | 2024-01-16 |