Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125642 | Method of manufacturing capacitor structure | Hsih-Yang Chiu | 2024-10-22 |
| 12113046 | Method for preparing semiconductor device with wire bond | Wei Li, Yi-Ting Shih, Hsih-Yang Chiu | 2024-10-08 |
| 12013798 | Method of data synchronization and redundant server system | Chin-Hung Tan, Heng-Chia Hsu, Yu-Shu Yeh, Chen-Yin Lin | 2024-06-18 |
| 11984389 | Integrated circuit package structure with conductive stair structure and method of manufacturing thereof | Hsih-Yang Chiu | 2024-05-14 |
| 11915952 | Temperature control method, apparatus, electronic device and storage medium for etching workbench | Yong-Ren Fang | 2024-02-27 |
| 11899419 | Integrated control management system | Heng-Chia Hsu, Chen-Yin Lin, Yu-Shu Yeh, Chin-Hung Tan | 2024-02-13 |
| 11876072 | Method for preparing semiconductor device with wire bond | Wei Li, Yi-Ting Shih, Hsih-Yang Chiu | 2024-01-16 |