Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154787 | Methods of performing selective low resistivity Ru atomic layer deposition and interconnect formed using the same | Michael Breeden, Andrew C. Kummel | 2024-11-26 |
| 12027488 | Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the same | Mike Breeden, Andrew C. Kummel, Ming Li, Muhannad Bakir, Jonathan Hollin +2 more | 2024-07-02 |