Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027488 | Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the same | Mike Breeden, Victor Wang, Andrew C. Kummel, Ming Li, Jonathan Hollin +2 more | 2024-07-02 |