Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087697 | Semiconductor devices with recessed pads for die stack interconnections | Andrew M. Bayless, Brandon P. Wirz | 2024-09-10 |
RS
Ruei Ying Sheng
Overall (2024): #288,729 of 561,600Top 55%
1
Patents 2024