Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148727 | Semiconductor device assembly with die support structures | David R. Hembree | 2024-11-19 |
| 12100661 | Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods | Andrew M. Bayless | 2024-09-24 |
| 12087697 | Semiconductor devices with recessed pads for die stack interconnections | Ruei Ying Sheng, Andrew M. Bayless | 2024-09-10 |
| 12087720 | Semiconductor device assembly with surface-mount die support structures | Benjamin L. McClain | 2024-09-10 |
| 11961818 | Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems | Andrew M. Bayless | 2024-04-16 |
| 11955345 | Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems | Liang Chen | 2024-04-09 |
| 11911904 | Apparatus and methods for enhanced microelectronic device handling | Kuan Wei Tseng | 2024-02-27 |
| 11908828 | Contaminant control in thermocompression bonding of semiconductors and associated systems and methods | Jaekyu Song, Sui Chi Huang | 2024-02-20 |