Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100661 | Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods | Brandon P. Wirz | 2024-09-24 |
| 12087697 | Semiconductor devices with recessed pads for die stack interconnections | Ruei Ying Sheng, Brandon P. Wirz | 2024-09-10 |
| 11961818 | Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems | Brandon P. Wirz | 2024-04-16 |