Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134814 | Cu—Ni—Si-based copper alloy sheet material, method for producing same, and current-carrying component | Wanqing Jiang, Hisashi Suda, Akira Sugawara | 2024-11-05 |
| 11946127 | Cu—Ti-based copper alloy sheet material, method for producing the same, electric current carrying component, and heat radiation component | Takuya Hashimoto, Hiroshi Yorifuji | 2024-04-02 |