Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134814 | Cu—Ni—Si-based copper alloy sheet material, method for producing same, and current-carrying component | Hiroshi Hyodo, Hisashi Suda, Akira Sugawara | 2024-11-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134814 | Cu—Ni—Si-based copper alloy sheet material, method for producing same, and current-carrying component | Hiroshi Hyodo, Hisashi Suda, Akira Sugawara | 2024-11-05 |