Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134814 | Cu—Ni—Si-based copper alloy sheet material, method for producing same, and current-carrying component | Wanqing Jiang, Hiroshi Hyodo, Akira Sugawara | 2024-11-05 |
| 11946129 | Cu—Ni—Al based copper alloy sheet material, method for producing same, and conductive spring member | Toshiya SHUTOH | 2024-04-02 |