Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160959 | Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board | Seiichi Suenaga, Sachiko FUJISAWA, Takashi Sano | 2024-12-03 |
| 12115603 | Bonded body, ceramic copper circuit substrate, and semiconductor device | Seiichi Suenaga, Sachiko FUJISAWA, Takashi Sano | 2024-10-15 |
| 11948900 | Bonded body, circuit board, and semiconductor device | Seiichi Suenaga, Sachiko FUJISAWA, Takayuki Naba | 2024-04-02 |