Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12167534 | Method for manufacturing a ceramic copper circuit board | Hiromasa Kato | 2024-12-10 |
| 12160959 | Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board | Maki Yonetsu, Seiichi Suenaga, Sachiko FUJISAWA | 2024-12-03 |
| 12115603 | Bonded body, ceramic copper circuit substrate, and semiconductor device | Maki Yonetsu, Seiichi Suenaga, Sachiko FUJISAWA | 2024-10-15 |
| 12078969 | Electronic device and wrist device | — | 2024-09-03 |