Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973003 | Ceramic metal circuit board and semiconductor device using the same | Keiichi Yano, Hiromasa Kato | 2024-04-30 |
| 11948900 | Bonded body, circuit board, and semiconductor device | Maki Yonetsu, Seiichi Suenaga, Sachiko FUJISAWA | 2024-04-02 |