Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142598 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2024-11-12 |
| 12002742 | Semiconductor package structure | Yuan Liu | 2024-06-04 |
| 11948895 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu | 2024-04-02 |
| 11942439 | Semiconductor package structure | Yung-Chang Lien | 2024-03-26 |
| 11862578 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2024-01-02 |