Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021032 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Yanggyoo Jung, Jinhyun Kang, Sungeun Kim, Sangmin Yong | 2024-06-25 |
SR
Seungkwan Ryu
Overall (2024): #275,896 of 561,600Top 50%
1
Patents 2024