Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967540 | Integrated circuit direct cooling systems having substrates in contact with a cooling medium | Seungwon IM, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2024-04-23 |
| 11961782 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Seungwon IM, Dongwook Kang | 2024-04-16 |
| 11901309 | Semiconductor device package assemblies with direct leadframe attachment | Seungwon IM | 2024-02-13 |