Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12078853 | Semiconductor package with embedded optical die | Vivek Raghunathan | 2024-09-03 |
| 11982854 | Co-packaging with silicon photonics hybrid planar lightwave circuit | Sang Yup Kim, Woosung Kim | 2024-05-14 |