Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12078853 | Semiconductor package with embedded optical die | Myung Jin Yim | 2024-09-03 |
| 11923327 | Silicon photonic interposer with two metal redistribution layers | Michael G. Lee, John Paul Drake, Ying Luo, Brett Michael Dunn Sawyer | 2024-03-05 |