Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11982854 | Co-packaging with silicon photonics hybrid planar lightwave circuit | Myung Jin Yim, Woosung Kim | 2024-05-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11982854 | Co-packaging with silicon photonics hybrid planar lightwave circuit | Myung Jin Yim, Woosung Kim | 2024-05-14 |