Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Jindong FENG, Shigui Xin +1 more | 2024-06-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Jindong FENG, Shigui Xin +1 more | 2024-06-04 |