Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159826 | Semiconductor package and method of manufacturing the semiconductor package | Myungsam Kang, Youngchan Ko, Jeongseok Kim | 2024-12-03 |
| 12119305 | Semiconductor package | Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2024-10-15 |
| 12094817 | Semiconductor package | Myungsam Kang, Youngchan Ko | 2024-09-17 |
| 12040297 | Methods of manufacturing semiconductor packages | Myungsam Kang, Youngchan Ko, Jeongseok Kim | 2024-07-16 |
| 11942434 | Method of manufacturing a semiconductor package | Sangkyu Lee, Jingu Kim, Shanghoon Seo, Jeongho Lee | 2024-03-26 |