Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881441 | Stacked die semiconductor package spacer die | Sireesha Gogineni, Andrew Tae Kim, Yong She | 2024-01-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881441 | Stacked die semiconductor package spacer die | Sireesha Gogineni, Andrew Tae Kim, Yong She | 2024-01-23 |