Issued Patents 2024
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148705 | Methods for forming semiconductor devices bonded by interposer structure | — | 2024-11-19 |
| D1044792 | Magnetic phone holder | — | 2024-10-01 |
| 12078791 | Method for tilting characterization by microscopy | Yu Li, Yi-Chen Li, Yingfei Wang, Shiyan Wu, Qiangmin Wei | 2024-09-03 |
| 12026444 | Dynamic port handling for isolated modules and dynamic function exchange | Hao Yu | 2024-07-02 |
| 12002788 | Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same | Weihua Cheng | 2024-06-04 |
| 11996389 | Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same | Weihua Cheng | 2024-05-28 |
| D1025525 | Bed vacuum cleaner | — | 2024-04-30 |
| 11968832 | Multiple-stack three-dimensional memory device and fabrication method thereof | Zongliang Huo, Li Xiao, Zhenyu Lu, Qian Tao, Yushi Hu +4 more | 2024-04-23 |
| 11950514 | Confined cell structures and methods of forming confined cell structures | Gurtej S. Sandhu | 2024-04-02 |
| 11950399 | Bonded semiconductor devices having processor and static random-access memory and methods for forming the same | — | 2024-04-02 |
| 11923339 | Integration of three-dimensional NAND memory devices with multiple functional chips | — | 2024-03-05 |
| 11910602 | Stacked connections in 3D memory and methods of making the same | Zongliang Huo | 2024-02-20 |
| 11887954 | Semiconductor devices having adjoined via structures formed by bonding and methods for forming the same | — | 2024-01-30 |
| 11864367 | Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same | Weihua Cheng | 2024-01-02 |