Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12137568 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2024-11-05 |
| 12089405 | Three-dimensional memory devices with channel structures having plum blossom shape | Wanbo Geng, Lei Xue, Xiaoxin Liu, Tingting Gao | 2024-09-10 |
| 12002788 | Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same | Jun Liu | 2024-06-04 |
| 11996389 | Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same | Jun Liu | 2024-05-28 |
| 11877449 | Methods for forming three-dimensional memory devices with channel structures having plum blossom shape | Wanbo Geng, Lei Xue, Xiaoxin Liu, Tingting Gao | 2024-01-16 |
| 11864367 | Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same | Jun Liu | 2024-01-02 |