Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869824 | Thermal interface structures for integrated circuit packages | Kyle Arrington, Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha R. Antoniswamy | 2024-01-09 |