Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166050 | Reliable semiconductor packages | Jeffrey D. Punzalan | 2024-12-10 |
| 12100719 | Reliable semiconductor packages | Jeffrey D. Punzalan | 2024-09-24 |
| 11961764 | Semiconductor device and method of making a wafer-level chip-scale package | Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2024-04-16 |
| 11901308 | Semiconductor packages with integrated shielding | Saravuth Sirinorakul, Kok Chuen Lock, Roel Adeva Robles, Eakkasit Dumsong | 2024-02-13 |
| 11881494 | Semiconductor package with dams | Jeffrey D. Punzalan | 2024-01-23 |