Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-10-08 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-01-16 |