Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157841 | Solventless adhesive composition process and laminate with same | Chenyan Bai, Elodie Hablot, Thorsten Schmidt, Abraham Barretto | 2024-12-03 |
| 11939498 | Water borne dry lamination bonding agent with heat resistance improvement | Mai Chen, Yuanjia Pan, Xinhong Wang, Xinchun Liu | 2024-03-26 |