Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157841 | Solventless adhesive composition process and laminate with same | Chenyan Bai, Elodie Hablot, Gaobing Chen, Abraham Barretto | 2024-12-03 |
| 12134715 | Two-component solvent-less adhesive composition | Tuoqi Li, Joseph J. Zupancic, Matthew M. Yonkey, Paul Clark, Wenwen Li | 2024-11-05 |
| 12116447 | Adhesive composition | Chenyan Bai, Hongyu Chen, Yingfeng Yu, Haijun Dong | 2024-10-15 |
| 12054652 | Two-component solvent-less adhesive composition | Tuoqi Li, Joseph J. Zupancic, Matthew M. Yonkey, Paul Clark, Ken Kawamoto +1 more | 2024-08-06 |