Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12018186 | Retort adhesive composition | Jie Wu, Sudhanwa Dewasthale | 2024-06-25 |
| 11981767 | Solventless adhesive composition and process for making and use in forming a laminate | Yinzhong Guo | 2024-05-14 |
| 11939498 | Water borne dry lamination bonding agent with heat resistance improvement | Yuanjia Pan, Xinhong Wang, Gaobing Chen, Xinchun Liu | 2024-03-26 |