Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062592 | Integrated circuit packages with thermal interface materials with different material compositions | Sergio Antonio Chan Arguedas, Amitesh Saha, Marco Aurelio Cartas, Ken Hackenberg | 2024-08-13 |