Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087352 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2024-09-10 |
| 12073906 | Package pin pattern for device-to-device connection | James A. McCall, Robert J. Friar, Yidnekachew S. Mekonnen, San K. Chhay | 2024-08-27 |