Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087352 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2024-09-10 |
| 12073906 | Package pin pattern for device-to-device connection | Chong J. Zhao, Robert J. Friar, Yidnekachew S. Mekonnen, San K. Chhay | 2024-08-27 |