Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080622 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Purakh Raj Verma, Ching-Yang Wen | 2024-09-03 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080622 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Purakh Raj Verma, Ching-Yang Wen | 2024-09-03 |